The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Jan. 20, 2017
Applicants:

Massachusetts Institute of Technology, Cambridge, MA (US);

National University of Singapore, Singapore, SG;

Nanyang Technological University, Singapore, SG;

Inventors:

Kwang Hong Lee, Singapore, SG;

Li Zhang, Singapore, SG;

Soo Jin Chua, Singapore, SG;

Eng Kian Kenneth Lee, Singapore, SG;

Eugene A. Fitzgerald, Cambridge, MA (US);

Chuan Seng Tan, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0254 (2013.01); H01L 21/0251 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02505 (2013.01);
Abstract

A method of fabricating a device on a carrier substrate, and a device on a carrier substrate. The method comprises providing a first substrate; forming one or more device layers on the first substrate; bonding a second substrate to the device layers on a side thereof opposite to the first substrate; and removing the first substrate.


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