The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Jul. 26, 2018
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Norio Sakai, Kyoto, JP;

Yoshihito Otsubo, Kyoto, JP;

Hideaki Hashi, Kyoto, JP;

Takayuki Tange, Kyoto, JP;

Munetake Miyashita, Kyoto, JP;

Takeshi Wake, Kyoto, JP;

Yasuhiro Higashide, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/00 (2006.01); H01F 27/29 (2006.01); H01F 41/10 (2006.01); H01F 17/04 (2006.01); H05K 3/28 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01); H01F 27/24 (2006.01); H01F 27/32 (2006.01); H01F 41/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01F 27/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 17/0013 (2013.01); H01F 17/0033 (2013.01); H01F 17/04 (2013.01); H01F 27/24 (2013.01); H01F 27/2847 (2013.01); H01F 27/2852 (2013.01); H01F 27/327 (2013.01); H01F 41/02 (2013.01); H01F 41/043 (2013.01); H01F 41/10 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 3/284 (2013.01); H01F 27/022 (2013.01); H01F 2017/002 (2013.01); H05K 2201/086 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/1316 (2013.01);
Abstract

An inductor componentincludes a resin layerand an inductor electrode. The inductor electrodeincludes metal pinstothat extend in the resin layerwith upper end surfaces thereof exposed from the upper surfaceof the resin layer, and upper wiring platesandthat are disposed on the upper surfaceof the resin layerand that connect upper end surfaces of the short metal pinsandand upper end surfaces of the long metal pinsandto each other. In this case, the inductor electrodeis formed of the metal pinstoand wiring platestothat each have a specific electrical resistance lower than that of a conductive paste and plating, and the resistance of the entire inductor electrodecan be decreased.


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