The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Dec. 13, 2018
Applicant:

Nippon Steel Nisshin Co., Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Yoshiaki Hori, Tokyo, JP;

Kazunari Imakawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 37/00 (2006.01); F28F 9/18 (2006.01); F28F 3/00 (2006.01); F28F 21/08 (2006.01); C22C 38/00 (2006.01); B23K 20/02 (2006.01);
U.S. Cl.
CPC ...
F28F 9/18 (2013.01); B23K 20/02 (2013.01); B23K 37/00 (2013.01); C22C 38/00 (2013.01); F28F 3/00 (2013.01); F28F 21/083 (2013.01); F28F 21/089 (2013.01); F28F 2275/02 (2013.01); F28F 2275/061 (2013.01);
Abstract

Provided is a method of manufacturing a heat exchanger by diffusion bonding in which deformation of bonding members as stainless steel plates is suppressed, and releasability (detachability of a bonding member from a release member) after diffusion bonding treatment is excellent. Provided is a method of manufacturing a heat exchanger, the method including layering a plurality of bonding membersmade of stainless steel, and applying heat and pressure to effect diffusion bonding of the bonding members, in which release membersare arranged on the both surface sides of the bonding members, and holding jigsare arranged so as to sandwich the bonding membersthrough the release members, and pressing is then performed through the holding jigswith a pressure device, and in which the diffusion bonding is performed using a combination of the release membersand the bonding members, the release membersincluding a steel material containing 1.5 mass % or more of Si, and a ratio (Fr/Fp) of the high-temperature strength (Fr) of the release membersat 1000° C. to the high-temperature strength (Fp) of the bonding membersat 1000° C. being 0.9 or more.


Find Patent Forward Citations

Loading…