The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Aug. 21, 2015
Ntn Corporation, Osaka, JP;
NTN CORPORATION, Osaka, JP;
Abstract
The present invention provides a method for producing a durable semispherical shoe which can be prevented from being subjected to seizure even in a dry lubrication state in which there is no lubricating oil at a start time of an operation of a swash plate compressor, can be restrained from deteriorating in its lubricating property due to generated frictional heat, and can be restrained from deteriorating in its strength at a production time and an injection molding die. A semispherical shoe (), for a swash plate compressor, to be produced by the production method has a base material (), consisting of a hard material, which has a hollow part along a central axis thereof and a resin layer, consisting of a resin composition, which is formed on a surface of a planar part, disposed on a periphery of the base member, which is to be subjected to sliding contact with the swash plate and on a surface of a spherical part, disposed on the periphery thereof, which is to be subjected to sliding contact with a piston. A resin-filled portion () where the resin composition is filled and an empty portion where the resin composition is not filled are formed in the hollow part of the base material. The resin-filled portion () and the resin layer are formed by injecting and filling the resin composition into a portion to be formed as the resin-filled portion () with the base material () being disposed inside a cavity () of the injection molding die.