The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Nov. 30, 2018
Applicant:
Fiberlean Technologies Limited, Cornwall, GB;
Inventors:
David Skuse, Cornwall, GB;
Jonathan Stuart Phipps, Cornwall, GB;
Sean Ireland, Hampden, ME (US);
Yun Jin, Cornwall, GB;
Assignee:
FiberLean Technologies Limited, Cornwall, GB;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
D21H 13/40 (2006.01); D21H 11/18 (2006.01); D21H 21/18 (2006.01); D21H 17/33 (2006.01); D21H 17/28 (2006.01); D21H 17/67 (2006.01); D21H 17/68 (2006.01); C04B 111/00 (2006.01); C04B 111/52 (2006.01); D21H 13/38 (2006.01); C04B 24/38 (2006.01); C04B 26/02 (2006.01); C04B 26/28 (2006.01);
U.S. Cl.
CPC ...
D21H 13/40 (2013.01); C04B 24/383 (2013.01); C04B 26/02 (2013.01); C04B 26/28 (2013.01); C04B 26/285 (2013.01); D21H 11/18 (2013.01); D21H 13/38 (2013.01); D21H 17/28 (2013.01); D21H 17/33 (2013.01); D21H 17/675 (2013.01); D21H 17/68 (2013.01); D21H 21/18 (2013.01); C04B 2111/00603 (2013.01); C04B 2111/52 (2013.01); Y02W 30/97 (2015.05);
Abstract
A composition for addition to a ceiling tile, flooring product, or other construction product may include microfibrillated cellulose and optionally an inorganic particulate material. The ceiling tile, flooring product, or other construction product may further include perlite, mineral wool, wood pulp, starch and other additives, where the wood pulp and other inorganic particulate materials are bonded to the microfibrillated cellulose. Methods of manufacturing the compound are also disclosed.