The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Mar. 10, 2017
Applicants:

Michael J. Naughton, Chestnut Hill, MA (US);

Chaobin Yang, Brighton, MA (US);

Kris Kempa, Chestnut Hill, MA (US);

Michael J. Burns, Bedford, MA (US);

Inventors:

Michael J. Naughton, Chestnut Hill, MA (US);

Chaobin Yang, Brighton, MA (US);

Kris Kempa, Chestnut Hill, MA (US);

Michael J. Burns, Bedford, MA (US);

Assignee:

The Trustees of Boston College, Chestnut Hill, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/095 (2006.01); C23C 18/38 (2006.01); H01B 1/02 (2006.01); C23C 18/42 (2006.01); C23C 18/16 (2006.01); C23C 18/52 (2006.01); G03F 7/11 (2006.01); B05D 1/32 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
C23C 18/38 (2013.01); C23C 18/1605 (2013.01); C23C 18/42 (2013.01); C23C 18/52 (2013.01); H01B 1/02 (2013.01); B05D 1/327 (2013.01); B05D 2201/02 (2013.01); B05D 2203/35 (2013.01); G03F 7/11 (2013.01); G03F 7/40 (2013.01);
Abstract

An all solution-processed deposition includes a non-water soluble, non-self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), a water soluble, self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), cracking of the film, and filling the cracks with a metal that is deposited in solution (e.g., by electroless disposition). A transparent substrate having a cracked water insoluble, non-self-cracking film surface coating includes a plurality of fissures therein extending to and exposing portions of the surface of the underlying transparent substrate is useful for producing a transparent conducting film.


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