The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Dec. 27, 2013
Applicant:

Tbm Co., Ltd., Chiyoda-ku, Tokyo, JP;

Inventor:

Yuichiro Sumi, Tokyo, JP;

Assignee:

TBM CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/20 (2006.01); C08J 5/18 (2006.01); C08K 3/26 (2006.01); C09D 129/04 (2006.01); C08K 5/098 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B32B 27/20 (2013.01); C08K 3/26 (2013.01); C08K 5/098 (2013.01); C09D 129/04 (2013.01); C08J 2323/06 (2013.01); C08K 2003/265 (2013.01);
Abstract

Provided is a plastic thin film material, on which a process material can be applied or deposited at low cost and with high efficiency, and in which an inorganic substance powder capable of achieving a functional processing for enabling the strong adhesion of a laminated layer on the thin film material is filled at a high density. A thin film material for processing use, which contains a thermoplastic resin and an inorganic substance powder at a weight ratio of 18:82 to 50:50, and has a specific gravity of 0.60 to 1.40 inclusive and a degree of absorption of water of 0.0 to 11.0 g/m·120 sec inclusive as measured by a Cobb method in accordance with JIS P 8140.


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