The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Jun. 29, 2017
Dic Corporation, Tokyo, JP;
Yukiko Fujita, Osaka, JP;
Takashi Yasumura, Osaka, JP;
DIC CORPORATION, Tokyo, JP;
Abstract
Provided is a fiber-reinforced molding material including as essential materials: a vinyl ester (A) that is a reaction product of an epoxy resin (a1) having an epoxy equivalent in the range of 180 to 500 and (meth)acrylic acid (a2); an unsaturated monomer (B) having a flash point of 100° C. or higher; a polyisocyanate (C); a polymerization initiator (D); and carbon fibers (E) having a fiber length of 2.5 to 50 mm, in which the mass ratio ((A)/(B)) of the vinyl ester (A) to the unsaturated monomer (B) is in the range of 40/60 to 85/15, and the molar ratio (NCO/OH) of isocyanate groups (NCO) in the polyisocyanate (C) to hydroxy groups (OH) in the vinyl ester (A) is in the range of 0.25 to 0.85.