The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Jan. 30, 2018
Addition-curable silicone resin composition and die attach material for optical semiconductor device
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Tatsuya Yamazaki, Annaka, JP;
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Abstract
Provided is a silicone resin composition having a low level of contamination to gold pad portions on an LED chip during curing of the composition and is excellent in adhesiveness to the silver lead frame on a substrate formed of a reflector member. An addition-curable silicone resin composition comprising (A-1) a linear organopolysiloxane having, per molecule, two or more alkenyl groups having 2 to 8 carbon atoms, (A-2) a branched organopolysiloxane having, per molecule, two or more alkenyl groups having 2 to 8 carbon atoms, (B-1) a branched organohydrogenpolysiloxane, wherein the weight average molecular weight of the polysiloxane and the content of SiH group-containing organosilicon compounds having 1 to 10 silicon atoms are each in a specified range, (B-2) a linear organohydrogenpolysiloxane, wherein the content of SiH group-containing organosilicon compounds having 1 to 10 silicon atoms is in a specified range, and (C) an addition reaction catalyst.