The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Oct. 02, 2015
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Natsuko Chayama, Otsu, JP;

Masao Tomikawa, Otsu, JP;

Tomoyuki Yuba, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2006.01); D04H 1/4326 (2012.01); D04H 1/728 (2012.01); D01F 6/74 (2006.01); D01D 5/00 (2006.01); D01D 1/02 (2006.01); H01M 2/14 (2006.01); H01M 2/16 (2006.01); C08L 79/08 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1075 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1071 (2013.01); C08L 79/08 (2013.01); D01D 1/02 (2013.01); D01D 5/003 (2013.01); D01F 6/74 (2013.01); D04H 1/4326 (2013.01); D04H 1/728 (2013.01); H01M 2/145 (2013.01); H01M 2/16 (2013.01); H01M 2/162 (2013.01);
Abstract

The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance. A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.


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