The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Dec. 15, 2017
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); C04B 35/465 (2006.01); C04B 35/04 (2006.01); C04B 41/53 (2006.01); C23C 18/16 (2006.01); C25D 5/02 (2006.01); C23C 18/42 (2006.01); C04B 41/52 (2006.01); C23C 18/32 (2006.01); C04B 41/45 (2006.01); C04B 41/88 (2006.01); C04B 41/00 (2006.01); C23C 18/38 (2006.01); C23C 18/18 (2006.01); C25D 5/48 (2006.01); C04B 41/90 (2006.01); C04B 111/00 (2006.01);
U.S. Cl.
CPC ...
C04B 35/465 (2013.01); C04B 35/04 (2013.01); C04B 41/009 (2013.01); C04B 41/4541 (2013.01); C04B 41/52 (2013.01); C04B 41/5353 (2013.01); C04B 41/88 (2013.01); C04B 41/90 (2013.01); C23C 18/1633 (2013.01); C23C 18/1651 (2013.01); C23C 18/1653 (2013.01); C23C 18/1689 (2013.01); C23C 18/1879 (2013.01); C23C 18/1893 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); C23C 18/42 (2013.01); C25D 5/02 (2013.01); C25D 5/48 (2013.01); C04B 2111/00844 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/72 (2013.01); Y10T 428/24917 (2015.01);
Abstract
A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.