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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10669184 B1

PDFFull Text
Date of Patent:
Jun. 02, 2020

Filed:

Jan. 22, 2016

Glass substrate and laminate using same

Applicant:

Nippon Electric Glass Co., Ltd., Shiga, JP;

Inventor:

Hiroki Katayama, Shiga, JP;

Assignee:

NIPPON ELECTRIC GLASS CO., LTD., Shiga, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Elizabeth E Mulvaney

Int. Cl.
CPC ...
B32B 3/02 (2006.01); C03B 17/06 (2006.01); H01L 23/00 (2006.01); C03C 23/00 (2006.01); B23K 26/60 (2014.01); B32B 17/06 (2006.01); B23K 26/352 (2014.01); B23K 26/0622 (2014.01); B23K 26/00 (2014.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/02 (2006.01); B23K 26/359 (2014.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01); C03C 3/093 (2006.01); C03C 3/091 (2006.01); B23K 103/16 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C03B 17/064 (2013.01); B23K 26/0006 (2013.01); B23K 26/0622 (2015.10); B23K 26/355 (2018.08); B23K 26/359 (2015.10); B23K 26/60 (2015.10); B32B 17/06 (2013.01); C03C 23/001 (2013.01); C03C 23/0025 (2013.01); H01L 21/02 (2013.01); H01L 21/02002 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); B23K 2103/172 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08); C03C 3/091 (2013.01); C03C 3/093 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A technical object of the present invention is to devise a glass substrate that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and enables correct recognition of production information and the like, and a laminate using the glass substrate. In order to achieve the technical object, the glass substrate of the present invention has a total thickness variation of less than 2.0 μm and includes an information identification part formed of a plurality of dots.

Find Patent Forward Citations

Katayama, Hiroki. (2020). Glass substrate and laminate using same (U.S. Patent No. 10669184). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10669184

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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