The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Oct. 22, 2019
Applicant:
Elite Material Co., Ltd., Taoyuan, TW;
Inventors:
Chia-Hui Huang, Taoyuan, TW;
Hsing-Lung Li, Taoyuan, TW;
Assignee:
ELITE MATERIAL CO., LTD., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01); B32B 27/00 (2006.01); B32B 38/00 (2006.01); B32B 15/08 (2006.01); B32B 15/18 (2006.01); B32B 27/04 (2006.01); B32B 15/14 (2006.01);
U.S. Cl.
CPC ...
B32B 15/20 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 15/18 (2013.01); B32B 27/04 (2013.01); B32B 38/0004 (2013.01); B32B 2260/02 (2013.01); Y10T 156/1062 (2015.01); Y10T 156/1322 (2015.01); Y10T 156/1746 (2015.01); Y10T 156/1761 (2015.01); Y10T 156/1783 (2015.01);
Abstract
Disclosed is an assembly manufacturing method comprising: cutting a prepreg into a prepreg sheet according to a first parameter; moving the prepreg sheet to an assembly arrangement area according to a second parameter; superimposing a metal foil and a plate according to a fourth parameter to form a copper foil set; and assembling the copper foil set and the prepreg sheet according to a third parameter to form an assembly.