The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Dec. 22, 2016
Fujikura Ltd., Tokyo, JP;
Shohei Kumeta, Tokyo, JP;
Gento Yoshino, Sakura, JP;
Yohei Kasai, Sakura, JP;
Akira Sakamoto, Sakura, JP;
FUJIKURA LTD., Tokyo, JP;
Abstract
The present invention provides a bonding method (S) which is capable of achieving a high adhesive force without carrying out any special treatment on the second member (), even in a case where the first member () has a surface on which a gold thin film () is formed. The first member () is made of a material other than gold and has a surface on which the gold thin film () is formed. The bonding method (S) includes the steps of: (S) irradiating, with laser light, at least part of a specific region () of the surface of the first member (), so that a base of the thin film () is exposed in the at least part of the specific region (); and (S) bonding the second member () to the specific region () by use of an adhesive ().