The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

May. 18, 2016
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Nicholas D. Abbatiello, Round Rock, TX (US);

David W. Williams, Salado, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/46 (2006.01); B29C 70/54 (2006.01); B29C 70/08 (2006.01); B29C 37/00 (2006.01); B29C 35/02 (2006.01); B29C 43/14 (2006.01); B29C 43/18 (2006.01); B29L 31/34 (2006.01); B29C 35/16 (2006.01); B29K 69/00 (2006.01); B29K 105/00 (2006.01); B29K 105/08 (2006.01); B29K 105/12 (2006.01); B29K 309/08 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
B29C 70/545 (2013.01); B29C 35/0288 (2013.01); B29C 37/0025 (2013.01); B29C 43/146 (2013.01); B29C 43/183 (2013.01); B29C 70/081 (2013.01); B29C 70/088 (2013.01); B29C 70/46 (2013.01); B29C 35/02 (2013.01); B29C 35/16 (2013.01); B29K 2069/00 (2013.01); B29K 2105/0881 (2013.01); B29K 2105/128 (2013.01); B29K 2105/253 (2013.01); B29K 2105/256 (2013.01); B29K 2307/04 (2013.01); B29K 2309/08 (2013.01); B29K 2313/00 (2013.01); B29L 2031/3481 (2013.01);
Abstract

An enclosure part for an information handling system is disclosed that may include materials formed together into a rectangular shape. The enclosure part may have a void on a core side and a flatness equal to or less than 0.5 mm. The materials may include a sheet of carbon fiber, a piece of non-woven carbon fiber, and a non-woven glass fiber. A method for manufacturing an enclosure part using through-plane temperature control may include inserting into a mold a sheet of carbon fiber and a piece of non-woven carbon fiber, heat pressing the sheet of carbon fiber with the piece of non-woven carbon fiber, and cooling a first portion of the mold including the sheet of carbon fiber and the piece of non-woven carbon fiber more quickly than a second portion of the mold including the sheet of carbon fiber, and removing the enclosure part from the mold.


Find Patent Forward Citations

Loading…