The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Jan. 30, 2015
Applicant:

United Technologies Corporation, Hartford, CT (US);

Inventor:

James M Koonankeil, Marlborough, CT (US);

Assignee:

Raytheon Technologies Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/00 (2006.01); B29C 45/14 (2006.01); B23P 15/16 (2006.01); B23K 26/40 (2014.01); B23K 26/382 (2014.01); B23K 26/00 (2014.01); B23K 26/18 (2006.01); B23P 15/02 (2006.01); B29C 35/08 (2006.01); F01D 5/18 (2006.01); B23H 9/10 (2006.01); B23H 9/14 (2006.01); B23K 103/18 (2006.01); B23K 101/00 (2006.01); B29L 31/08 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14344 (2013.01); B23K 26/009 (2013.01); B23K 26/18 (2013.01); B23K 26/389 (2015.10); B23K 26/40 (2013.01); B23P 15/02 (2013.01); B23P 15/16 (2013.01); B29C 35/0805 (2013.01); B23H 9/10 (2013.01); B23H 9/14 (2013.01); B23K 2101/001 (2018.08); B23K 2103/26 (2018.08); B23P 2700/06 (2013.01); B29C 2035/0838 (2013.01); B29K 2023/04 (2013.01); B29L 2031/082 (2013.01); F01D 5/186 (2013.01); F05D 2230/13 (2013.01);
Abstract

A method for disposing blocking material within an interior of a component for blocking a beam of radiation from a laser during a laser drilling operation, the method including forming one of a multiple of apertures formed via a first process and forming the remainder of the multiple of apertures formed via a laser drilling process. A component for a gas turbine engine includes a surface with at least one of a multiple of apertures formed via a first process, the at least one of the multiple of apertures formed via the first process in communication with a cavity, a remainder of the multiple of apertures formed via a laser drilling process, the remainder of the multiple of apertures in communication with the cavity.


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