The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Mar. 22, 2012
Ryan T. Flavin, Canton, MI (US);
Bradley P. Van Dike, Livonia, MI (US);
Mark W. Wynn, Westland, MI (US);
Daniel J. Welker, Newport, MI (US);
Ryan T. Flavin, Canton, MI (US);
Bradley P. Van Dike, Livonia, MI (US);
Mark W. Wynn, Westland, MI (US);
Daniel J. Welker, Newport, MI (US);
Yazaki North America, Inc., Canton, MI (US);
Abstract
A method for molding a component. The method includes: providing a mold tool having a sprue and a cavity; heating the mold tool to a predetermined mold temperature; placing the heated mold tool into a pressure vessel; pouring a material through the sprue into the cavity of the heated mold tool; prior to complete polymerization of the material in the cavity of the heated mold tool, elevating an internal pressure of the pressure vessel to a predetermined pressure to apply a force to the material in the heated mold tool; completely polymerizing the material in the cavity in heated mold tool to form the molded component; and removing the molded component from the mold tool.