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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10668650 B1

PDFFull Text
Date of Patent:
Jun. 02, 2020

Filed:

Jun. 22, 2015

Thermosetting composition, and method for manufacturing thermoset resin

Applicant:

Idemitsu Kosan Co., Ltd., Chiyoda-ku, JP;

Inventors:

Yutaka Obata, Ichihara, JP;

Takeshi Iwasaki, Ichihara, JP;

Daichi Ogawa, Ichihara, JP;

Haruhiko Mori, Ichihara, JP;

Assignee:

IDEMISTU KOSAN CO., LTD., Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Hannah J Pak

Int. Cl.
CPC ...
C08K 3/00 (2018.01); B29C 39/26 (2006.01); H01L 33/60 (2010.01); C08L 33/04 (2006.01); B29C 45/02 (2006.01); C08F 20/10 (2006.01); C08F 292/00 (2006.01); C08F 2/44 (2006.01); B29C 45/14 (2006.01); B29C 45/54 (2006.01); C08K 3/36 (2006.01); C08K 3/013 (2018.01); B29C 39/00 (2006.01); C08K 9/06 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); B29K 101/10 (2006.01); B29C 33/10 (2006.01); B29L 11/00 (2006.01); B29C 33/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 39/26 (2013.01); B29C 39/003 (2013.01); B29C 45/02 (2013.01); B29C 45/14336 (2013.01); B29C 45/54 (2013.01); C08F 2/44 (2013.01); C08F 20/10 (2013.01); C08F 292/00 (2013.01); C08K 3/013 (2018.01); C08K 3/36 (2013.01); C08K 9/06 (2013.01); C08L 33/04 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); B29C 33/0038 (2013.01); B29C 33/10 (2013.01); B29K 2101/10 (2013.01); B29L 2011/00 (2013.01); B29L 2011/0083 (2013.01); B29L 2031/34 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A thermosetting composition comprising: (A) a (meth)acrylate compound having a viscosity at 25° C. of 1 to 300 mPa·s with which a substituted or unsubstituted aliphatic hydrocarbon group including 6 or more carbon atoms is ester-bonded; (B) spherical silica; and (C) a white pigment, and having a shear viscosity at 25° C. and 10 sof 1 Pa·s or more and 500 Pa·s or less and a shear velocity at 25° C. and 100 sof 0.3 Pa·s or more and 100 Pa·s or less.

Find Patent Forward Citations

Obata, Yutaka. (2020). Thermosetting composition, and method for manufacturing thermoset resin (U.S. Patent No. 10668650). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10668650

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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