The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Mar. 17, 2017
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 3/04 (2006.01); H05K 3/36 (2006.01); H05B 3/14 (2006.01); B23K 1/00 (2006.01); H01L 21/683 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 21/67 (2006.01); H05B 3/62 (2006.01); B23K 101/42 (2006.01); H01R 43/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 20/004 (2013.01); B23K 1/0016 (2013.01); B23K 3/04 (2013.01); H01L 21/67103 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H05B 3/143 (2013.01); H05B 3/62 (2013.01); H05K 1/028 (2013.01); H05K 1/118 (2013.01); H05K 3/363 (2013.01); B23K 2101/42 (2018.08); H01L 21/67069 (2013.01); H01R 43/02 (2013.01); H05K 1/0212 (2013.01); H05K 3/3494 (2013.01);
Abstract
A metal wiring bonding structurecomprises contactsof connection FPCand heater landsof a sheet heaterto be bonded by a solder bonding member. A connection FPCincludes contact opposed landsfamed of metal and disposed at positions respectively opposed to the plurality of contactson a surface of a support layeropposite from a surface on which metal wiresare provided, and through holespenetrating the contact opposed lands, the support layer, and contacts. Solder bonding memberscover surfaces of contact opposed landsand are filled inside through holesand in a bonding space C.