The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Jun. 24, 2016
Applicant:

Neturen Co., Ltd., Tokyo, JP;

Inventors:

Takashi Horino, Tokyo, JP;

Akira Terajima, Tokyo, JP;

Fumiaki Ikuta, Tokyo, JP;

Hiroki Inoue, Tokyo, JP;

Assignee:

Neturen Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); B23K 11/11 (2006.01); G06F 30/23 (2020.01); B23K 11/26 (2006.01); B23K 11/31 (2006.01); G06F 113/24 (2020.01);
U.S. Cl.
CPC ...
B23K 11/115 (2013.01); B23K 11/26 (2013.01); B23K 11/314 (2013.01); G06F 30/23 (2020.01); G06F 2113/24 (2020.01);
Abstract

A direct resistance heating simulation method is provided. In this method, a welding region and its peripheral region of steel sheets to be welded by a pair of electrodes are divided into a plurality of elements. A coupled analysis is performed such that a temperature, a metal structure, stress and strain at each element are determine in a mutually associated manner based on Joule loss obtained through a current analysis and a magnetic field analysis for each element. The coupled analysis is repeated to predict an effect of one or more parameters, including at least one of a frequency, a magnitude and an application time of electric current to be applied to the electrodes, a cooling time, a pressure applied from the electrodes to the steel sheets and a shape of the electrodes, on welding quality after a post-heating by direct resistance heating and to improve weld strength.


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