The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Feb. 15, 2018
Applicant:

Siemens Aktiengesellschaft, Müchen, DE;

Inventor:

Jürgen Zettner, Veitsbronn, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); B22F 3/10 (2006.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B33Y 30/00 (2015.01); B29C 64/153 (2017.01); B29C 64/205 (2017.01);
U.S. Cl.
CPC ...
B22F 3/1055 (2013.01); B22F 3/1017 (2013.01); B29C 64/153 (2017.08); B29C 64/205 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B22F 2003/1057 (2013.01); B22F 2203/03 (2013.01); B22F 2203/11 (2013.01); B22F 2999/00 (2013.01); Y02P 10/295 (2015.11);
Abstract

First subareas of a layer of powder applied on a substrate are heated locally with a process beam so as to heated, but not yet interconnect the grains of the powder in the first subareas. A temperature profile of the applied layer is evaluated proximate to the first subarea as a function of the distance from the respective first subarea and/or the time. The local thermal conductivity and/or local diffusivity are determined for the respective first subarea based on the temperature profile. Second subareas of the applied layer which at least partially overlap the first subareas are then heated locally with the process beam so as to interconnect the grains of the powder in the second subareas. A process variable of the process beam influencing heating of the second subareas is determined based on the local thermal conductivity or diffusivity previously determined for the at least partially overlapping first subarea.


Find Patent Forward Citations

Loading…