The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Mar. 04, 2016
Applicant:

Airbus Operations Gmbh, Hamburg, DE;

Inventor:

Bernd Ruppert, Hamburg, DE;

Assignee:

Airbus Operations GmbH, Hamburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/10 (2006.01); B22F 3/11 (2006.01); B22F 7/00 (2006.01); B22F 1/02 (2006.01); B28B 1/00 (2006.01); B22F 3/105 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C04B 35/628 (2006.01); C04B 35/622 (2006.01); C22C 26/00 (2006.01); C22C 32/00 (2006.01); C22C 1/10 (2006.01);
U.S. Cl.
CPC ...
B22F 1/02 (2013.01); B22F 3/1055 (2013.01); B28B 1/001 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C04B 35/622 (2013.01); C04B 35/62828 (2013.01); C04B 35/62831 (2013.01); C04B 35/62836 (2013.01); C04B 35/62839 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C04B 2235/386 (2013.01); C04B 2235/3839 (2013.01); C04B 2235/3847 (2013.01); C04B 2235/445 (2013.01); C04B 2235/446 (2013.01); C04B 2235/5288 (2013.01); C04B 2235/6026 (2013.01); C04B 2235/665 (2013.01); C22C 1/1031 (2013.01); C22C 26/00 (2013.01); C22C 32/0047 (2013.01); C22C 32/0089 (2013.01); Y02P 10/295 (2015.11);
Abstract

A 3D printing method includes mixing a sintered component which is selected from the group comprising ceramic materials, ceramic material combinations, metal materials, metal material combinations and metal alloys, with at least one surface coating component which is selected from the group comprising boron nitride, graphene, carbon nanotubes, tungsten sulfide, tungsten carbide, molybdenum sulfide, molybdenum carbide, calcium fluoride, caesium molybdenum oxide sulfide, titanium silicon carbide and cerium fluoride, in a powder mixture; and laser sintering or laser melting the powder mixture in a selective laser sintering method or a selective laser melting method.


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