The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Nov. 19, 2015
Applicant:
Andritz Ag, Graz, AT;
Inventor:
Helmuth Gabl, Graz, AT;
Assignee:
Andritz AG, Graz, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B03B 9/00 (2006.01); B03B 9/06 (2006.01); B02C 7/14 (2006.01); B02C 7/18 (2006.01); B02C 23/36 (2006.01); B02C 19/18 (2006.01); D21D 1/30 (2006.01); B02C 7/11 (2006.01); B02C 7/02 (2006.01); B02C 23/02 (2006.01); B02C 23/10 (2006.01); B03B 5/04 (2006.01); B03C 1/30 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
B03B 9/061 (2013.01); B02C 7/02 (2013.01); B02C 7/11 (2013.01); B02C 7/14 (2013.01); B02C 7/186 (2013.01); B02C 19/186 (2013.01); B02C 23/02 (2013.01); B02C 23/10 (2013.01); B02C 23/36 (2013.01); B03B 5/04 (2013.01); B03C 1/30 (2013.01); D21D 1/30 (2013.01); D21D 1/303 (2013.01); D21D 1/306 (2013.01); H05K 3/00 (2013.01); B03C 2201/20 (2013.01); H05K 2203/178 (2013.01); Y02W 30/521 (2015.05); Y02W 30/82 (2015.05); Y02W 30/822 (2015.05);
Abstract
The subject of the present invention is a method for processing electrical and electronic components in order to recover valuable materials, such as the metals contained in printed circuit boards. According to this method, the electrical and electronic components are pre-shredded mechanically and then mixed with a liquid before they undergo wet milling ().