The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Jul. 06, 2016
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventor:
Timothy J Sutherland, San Diego, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/20 (2006.01); G12B 15/06 (2006.01); G06F 1/20 (2006.01); H05K 5/03 (2006.01); G06F 1/16 (2006.01); H01Q 7/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20436 (2013.01); G06F 1/20 (2013.01); G06F 1/203 (2013.01); G12B 15/06 (2013.01); H05K 5/0017 (2013.01); H05K 5/0086 (2013.01); H05K 5/03 (2013.01); H05K 7/20327 (2013.01); H05K 7/20463 (2013.01); G06F 1/1698 (2013.01); G06F 2200/201 (2013.01); H01Q 7/00 (2013.01);
Abstract
In some examples, an electronic device includes an outer housing and a heat spreader inside an inner chamber defined by the outer housing. The heat spreader is structurally engaged to the outer housing to provide structural support for the outer housing, and the heat spreader is to spread heat along two different directions. Electronic components are in thermal contact with a surface of the heat spreader to transfer heat produced by the electronic components to the heat spreader.