The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Apr. 29, 2019
Applicant:

Hewlett Packard Enterprise Development Lp, Houston, TX (US);

Inventors:

Harvey J. Lunsman, Chippewa Falls, WI (US);

John Franz, Houston, TX (US);

Tahir Cader, Liberty Lake, WA (US);

Ernesto Ferrer Medina, Aguadilla, PR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); G06F 1/20 (2013.01); H05K 1/0203 (2013.01); H05K 7/20254 (2013.01); G06F 2200/201 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10393 (2013.01);
Abstract

An example thermal interface device to attach to and cool a memory module. The device includes two sides sections that cover and contact the side faces of the memory module when installed. The device includes an outer layer that is a thermally conductive and resilient material, and an inner layer that is a thermally conductive and malleable metal. The inner layer may be nested within the outer layer, and the inner layer contacts the memory circuits of the memory module when installed. The outer layer includes spring fingers extending outward so as to contact and be compressed by a heat transfer device, such as a heat pipe, that is positioned on a side of the memory module. A thermally conductive path is thereby provided between the memory module and the heat transfer device via the thermal interface device.


Find Patent Forward Citations

Lunsman, Harvey. (2020). Memory module cooling (U.S. Patent No. 10667431). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10667431

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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