The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Nov. 27, 2018
Applicant:
Nokia Solutions and Networks Oy, Espoo, FI;
Inventors:
Alex Chan, Ottawa, CA;
Paul Brown, Wakefield, CA;
Assignee:
NOKIA SOLUTIONS AND NETWORKS OY, Espoo, FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 21/02 (2006.01); H01L 21/56 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H05K 1/11 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 2201/041 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09745 (2013.01);
Abstract
A printed circuit board (PCB) carrier including a multi-layer structure including a plurality of conductive layers and a plurality of insulating layers respectively spaced between the plurality of conductive layers, the multi-layer structure having a footprint corresponding to a large size component of the PCB, and a pocket formed in the multi-layer structure, the pocket configured to receive a discrete component of a size smaller than the large size component.