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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10667397 B1

PDFFull Text
Date of Patent:
May. 26, 2020

Filed:

Dec. 12, 2016

Electronic device having a plated antenna and/or trace, and methods of making and using the same

Applicant:

Mao Ito, Santa Cruz, CA (US);

Inventor:

Mao Ito, Santa Cruz, CA (US);

Assignee:

Thin Film Electronics ASA, Oslo, NO;

Attorneys:

Andrew D. Fortney

Central California IP Group, P.C.

Primary Examiner:

Steven T Sawyer

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01Q 1/38 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01Q 1/22 (2006.01); H01Q 7/00 (2006.01); H01L 23/00 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 21/4867 (2013.01); H01L 23/49822 (2013.01); H01L 23/49855 (2013.01); H01L 24/00 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/38 (2013.01); H01Q 7/00 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/09281 (2013.01); H05K 2201/09772 (2013.01);
Abstract

An electronic device, and methods of manufacturing the same are disclosed. The method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an integrated circuit or a discrete electrical component on a second substrate, forming electrical connectors on input and/or output terminals of the integrated circuit or discrete electrical component, forming a second metal layer on the first metal layer, the second metal layer improving adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the integrated circuit or discrete electrical component, and electrically connecting the electrical connectors to the second metal layer.

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