The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Aug. 25, 2017
Applicant:

Tactotek Oy, Oulunsalo, FI;

Inventors:

Antti Keranen, Oulunsalo, FI;

Ronald Haag, Oulunsalo, FI;

Mikko Heikkinen, Oulunsalo, FI;

Assignee:

TACTOTEK OY, Oulunsalo, FI;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H05K 1/0203 (2013.01); H05K 3/284 (2013.01); H05K 3/4069 (2013.01); H05K 1/0266 (2013.01); H05K 1/0274 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract

Integrated multilayer structure () comprising a first substrate film () having a first side (A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer () molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (), optionally comprising an electronic, electromechanical and/or electro-optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.


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