The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Apr. 18, 2018
Applicant:

Ams Sensors Singapore Pte. Ltd., Singapore, SG;

Inventor:

Peter Riel, Bach, CH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H05K 1/02 (2006.01); B23K 1/00 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); B23K 1/008 (2006.01); B23K 35/02 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0272 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); H05K 1/0269 (2013.01); H05K 1/0306 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 3/3421 (2013.01); H05K 3/3494 (2013.01); H05K 3/3431 (2013.01); H05K 3/3452 (2013.01); H05K 2201/09663 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/09909 (2013.01); H05K 2201/09918 (2013.01); H05K 2201/10121 (2013.01); H05K 2203/048 (2013.01); H05K 2203/0445 (2013.01); H05K 2203/0571 (2013.01); H05K 2203/166 (2013.01); Y02P 70/611 (2015.11); Y02P 70/613 (2015.11);
Abstract

One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.


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