The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Feb. 14, 2018
Lumens Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Seung Hyun Oh, Gwangju-si, KR;
Seung Hoon Lee, Yongin-si, KR;
Sung Yole Yun, Yongin-si, KR;
Jung A Lim, Yongin-si, KR;
Sung Sik Jo, Jeollanam-do, KR;
In Soo Kim, Suwon-si, KR;
Tae Kyung Yoo, Seongnam-si, KR;
LUMENS CO., LTD., Yongin-si, KR;
Abstract
Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.