The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Dec. 16, 2016
Applicant:
Humatics Corporation, Cambridge, MA (US);
Inventors:
Gregory L. Charvat, Guilford, CT (US);
David A. Mindell, Cambridge, MA (US);
Assignee:
Humatics Corporation, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); G01S 13/87 (2006.01); G01S 5/14 (2006.01); H01Q 1/38 (2006.01); H01Q 9/04 (2006.01); H01Q 1/52 (2006.01); H01Q 9/26 (2006.01); H04B 5/00 (2006.01); H04W 4/02 (2018.01); H04W 56/00 (2009.01); H01Q 1/24 (2006.01); H01Q 5/10 (2015.01); G01S 5/02 (2010.01); H04W 64/00 (2009.01); G01S 11/02 (2010.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); G01S 5/0284 (2013.01); G01S 5/14 (2013.01); G01S 11/02 (2013.01); G01S 13/878 (2013.01); H01Q 1/2216 (2013.01); H01Q 1/24 (2013.01); H01Q 1/247 (2013.01); H01Q 1/38 (2013.01); H01Q 1/525 (2013.01); H01Q 5/10 (2015.01); H01Q 9/0428 (2013.01); H01Q 9/26 (2013.01); H04B 5/0056 (2013.01); H04W 4/023 (2013.01); H04W 56/001 (2013.01); H04W 64/003 (2013.01); G01S 5/0215 (2013.01); H04W 64/006 (2013.01);
Abstract
A device comprising: a substrate; a semiconductor die mounted on the substrate; a transmit antenna fabricated on the substrate and configured to transmit radio-frequency (RF) signals at least at a first center frequency; a receive antenna fabricated on the substrate and configured to receive RF signals at least at a second center frequency different than the first center frequency; and circuitry integrated with the semiconductor die and configured to provide RF signals to the transmit antenna and to receive RF signals from the receive antenna.