The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Oct. 18, 2016
Applicant:

Honda Motor Co., Ltd., Minato-Ku, Tokyo, JP;

Inventors:

Suguru Ohmori, Wako, JP;

Yukihito Tanaka, Wako, JP;

Yoshihito Kimura, Wako, JP;

Ryugo Fujitsuka, Wako, JP;

Shintaro Tanaka, Wako, JP;

Masaki Tani, Wako, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 8/0273 (2016.01); H01M 8/0284 (2016.01); H01M 8/0286 (2016.01); H01M 8/1004 (2016.01); H01M 8/1018 (2016.01);
U.S. Cl.
CPC ...
H01M 8/0273 (2013.01); H01M 8/0284 (2013.01); H01M 8/0286 (2013.01); H01M 8/1004 (2013.01); H01M 8/1018 (2013.01); H01M 2008/1095 (2013.01); H01M 2250/20 (2013.01); Y02E 60/521 (2013.01); Y02T 90/32 (2013.01);
Abstract

A resin frame equipped membrane electrode assembly includes an MEA having different sizes of components, and a resin frame member. A resin melt portion is provided for the resin frame member. The inside of a first gas diffusion layer is impregnated with resin as a part of the resin melt portion. A thin portion is provided at an outermost peripheral portion of the resin frame member through a step at an outermost peripheral portion of the resin melt portion, and the thin portion is thinner in a thickness direction than the resin melt portion.


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