The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Dec. 15, 2017
Applicant:

Saphlux, Inc., Branford, CT (US);

Inventors:

Joo Won Choi, Woodbridge, CT (US);

Chen Chen, New Haven, CT (US);

Jie Song, New Haven, CT (US);

Assignee:

Saphlux, Inc., Branford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/32 (2010.01); H01L 33/08 (2010.01); C30B 29/40 (2006.01); H01L 33/24 (2010.01); H01L 21/02 (2006.01); H01L 29/20 (2006.01); H01L 27/15 (2006.01); C30B 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 33/325 (2013.01); C30B 25/18 (2013.01); C30B 29/406 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02458 (2013.01); H01L 21/02491 (2013.01); H01L 21/02513 (2013.01); H01L 21/02658 (2013.01); H01L 27/153 (2013.01); H01L 29/2003 (2013.01); H01L 33/08 (2013.01); H01L 33/24 (2013.01); H01L 21/0242 (2013.01);
Abstract

Aspects of the disclosure provide for mechanisms for forming air voids for semiconductor fabrication. In accordance with some embodiments, a method for forming air voids may include forming a first semiconductor layer including a first group III material and a second group III material on a substrate; forming a plurality of air voids in the first semiconductor layer by removing at least a portion of the second group III material from the first semiconductor layer; and forming a second semiconductor layer on the first semiconductor layer. The second semiconductor layer may include an epitaxial layer of a group III-V material. In some embodiments, the first group III material and the second group III material may be gallium and indium, respectively.


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