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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10665747 B1

PDFFull Text
Date of Patent:
May. 26, 2020

Filed:

Apr. 26, 2018

Optoelectronic semiconductor component

Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Karl Weidner, München, DE;

Ralph Wirth, Lappersdorf, DE;

Axel Kaltenbacher, Ingolstadt, DE;

Walter Wegleiter, Nittendorf, DE;

Bernd Barchmann, Regensburg, DE;

Oliver Wutz, Regensburg, DE;

Jan Marfeld, Regensburg, DE;

Assignee:

OSRAM Opto Semiconductors GmbH, Regensburg, DE;

Attorney:

DLA Piper LLP (US)

Primary Examiner:

Andy Huynh

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 23/31 (2006.01); H01L 31/0232 (2014.01); H01L 33/60 (2010.01); H01L 31/0203 (2014.01); H01L 33/56 (2010.01); H01L 25/04 (2014.01); H01L 33/50 (2010.01); H01L 31/18 (2006.01); H01L 33/54 (2010.01); H01L 31/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0079 (2013.01); H01L 23/3107 (2013.01); H01L 23/3185 (2013.01); H01L 25/042 (2013.01); H01L 25/0753 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/0232 (2013.01); H01L 31/02322 (2013.01); H01L 31/02327 (2013.01); H01L 31/1892 (2013.01); H01L 33/483 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/54 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.

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