The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Mar. 24, 2017
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Li-Fan Lin, Taoyuan, TW;

Po-Chin Peng, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 23/535 (2006.01); H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 23/00 (2006.01); H01L 23/482 (2006.01); H01L 29/20 (2006.01); H01L 27/06 (2006.01); H01L 27/02 (2006.01); H01L 29/10 (2006.01); H01L 21/8252 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7787 (2013.01); H01L 23/482 (2013.01); H01L 23/535 (2013.01); H01L 24/06 (2013.01); H01L 27/0251 (2013.01); H01L 27/0605 (2013.01); H01L 27/0629 (2013.01); H01L 29/2003 (2013.01); H01L 29/402 (2013.01); H01L 29/41758 (2013.01); H01L 29/7786 (2013.01); H01L 21/8252 (2013.01); H01L 24/48 (2013.01); H01L 29/1066 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05093 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49111 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10344 (2013.01); H01L 2924/13064 (2013.01);
Abstract

A semiconductor device includes a substrate, a power device, a protection circuit, a dielectric layer, a drain pad, a source pad, and a gate pad. The power device and the protection circuit are disposed on the substrate. The power device includes a drain electrode, a source electrode, and a gate electrode. The protection circuit has a first terminal electrically connected with the source pad and a second terminal electrically connected with the gate pad. The dielectric layer is disposed on the power device and the protection circuit. The drain pad, the source pad, and the gate pad are disposed on the dielectric layer and respectively electrically connected with the drain electrode, the source electrode, and the gate electrode. At least part of the protection circuit is disposed under the source pad, the gate pad, or the drain pad.


Find Patent Forward Citations

Loading…