The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Jul. 20, 2016
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Kazutoyo Takano, Fukuoka, JP;
Kazushige Matsuo, Fukuoka, JP;
Masayoshi Hirao, Fukuoka, JP;
Junji Yahiro, Fukuoka, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/304 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01); H01L 29/12 (2006.01); H01L 27/04 (2006.01); H01L 21/04 (2006.01); H01L 21/683 (2006.01); H01L 27/06 (2006.01); H01L 29/10 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0661 (2013.01); H01L 21/042 (2013.01); H01L 21/0475 (2013.01); H01L 21/304 (2013.01); H01L 21/3043 (2013.01); H01L 21/6835 (2013.01); H01L 27/04 (2013.01); H01L 27/0664 (2013.01); H01L 29/0623 (2013.01); H01L 29/1095 (2013.01); H01L 29/12 (2013.01); H01L 29/1602 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/6631 (2013.01); H01L 29/66045 (2013.01); H01L 29/66068 (2013.01); H01L 29/66348 (2013.01); H01L 29/739 (2013.01); H01L 29/7397 (2013.01); H01L 29/78 (2013.01); H01L 29/8613 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A semiconductor device according to the present invention includes a substrate having a cell portion and a terminal portion surrounding the cell portion, a surface structure provided on the substrate, and a back surface electrode provided on the back surface of the substrate, the surface structure includes a convex portion protruding upward above the cell portion, and at least a part of the cell portion is thinner than the terminal portion.