The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Feb. 10, 2017
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Motonari Honda, Kanagawa, JP;

Ryoji Suzuki, Kanagawa, JP;

Takeshi Matsunuma, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 27/146 (2006.01); H01L 21/768 (2006.01); H04N 5/374 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 21/7682 (2013.01); H01L 27/14603 (2013.01); H01L 27/14645 (2013.01); H01L 27/14667 (2013.01); H01L 27/1464 (2013.01); H04N 5/3741 (2013.01);
Abstract

The present technology relates to an imaging device designed to be able to reduce luminance unevenness. An imaging device includes a photodiode and a wiring layer formed on a surface facing the incident surface of the photodiode. A wiring line is formed in the wiring layer, and the wiring line in a pixel is formed in a different pattern from a pattern in a different pixel. Another imaging device including a photodiode and a wiring layer formed on a surface facing the incident surface of the photodiode. A wiring line is formed in the wiring layer. A gap having a different dielectric constant from the dielectric constant of the material forming the wiring layer is formed in the wiring layer, and the gap in a pixel is formed in a different pattern from a pattern in a different pixel. The present technology can be applied to imaging devices.


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