The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Jun. 13, 2018
Applicant:

Stanley Electric Co., Ltd., Meguro-ku, Tokyo, JP;

Inventors:

Reiki Tada, Tokyo, JP;

Akihiko Hanya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 25/13 (2006.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/40 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 25/13 (2013.01); H01L 33/405 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 25/0756 (2013.01);
Abstract

Provided is an optically transparent plate having a structure where an LED die is directly mounted on an optically transparent substrate, and light extraction efficiency is improved. The optically transparent plate comprises, an optically transparent substrate, a wiring pattern placed on either of a surface on the upper side and a surface on the underside of the optically transparent substrate, or on both of the surfaces, and the LED die bonded to the wiring pattern. A reflective layer is placed on the other side, of the surface of the optically transparent substrate on which the LED die is mounted. At least a part of the wiring pattern and at least a part of the reflective layer comprise a conductive material obtained by sintering conductive particles.


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