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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10665530 B1

PDFFull Text
Date of Patent:
May. 26, 2020

Filed:

Apr. 02, 2019

Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems

Applicant:

Microfabrica Inc., Van Nuys, CA (US);

Inventors:

Richard T. Chen, San Jose, CA (US);

Will J. Tan, Pasadena, CA (US);

Assignee:

Microfabrica Inc., Van Nuys, CA (US);

Attorney:

Dennis R. Smalley

Primary Examiner:

Monica D Harrison

Int. Cl.
CPC ...
H01L 23/473 (2006.01); F28F 3/12 (2006.01); F28F 13/06 (2006.01); H01L 21/48 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4735 (2013.01); F28F 3/12 (2013.01); F28F 13/06 (2013.01); H01L 21/4871 (2013.01); H01L 21/4882 (2013.01); H01L 23/473 (2013.01); H05K 7/20254 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01); F28F 2260/02 (2013.01);
Abstract

Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

Find Patent Forward Citations

Chen, Richard. (2020). Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems (U.S. Patent No. 10665530). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10665530

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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