The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Nov. 16, 2017
Applicant:

Sagemcom Broadband Sas, Rueil Malmaison, FR;

Inventors:

Gilles Bourgoin, Rueil Malmaison, FR;

Alain Tisne, Rueil Malmaison, FR;

Assignee:

SAGEMCOM BROADBAND SAS, Rueil Malmaison, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/433 (2006.01); F28F 3/04 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4338 (2013.01); F28F 3/04 (2013.01); H01L 23/3672 (2013.01); H01L 23/49855 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 2223/6644 (2013.01);
Abstract

Removing device including: a heat exchanger that is mounted on a platen so that the exchanger lies above and a distance away from an electronic component; a chassis that lies between the electronic component and the platen, and device for fastening the chassis to the platen or to the electronic board; a rigid heat sink that is mounted on the chassis in order to slide perpendicularly to the electronic board and that has a first end making contact with the component and a second end in abutment against a thermally conductive layer that is fastened to the platen in order to elastically return the rigid heat sink into abutment against the electronic component whatever the thickness of the electronic component. Electronic equipment having such a removing device.


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