The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Sep. 30, 2015
Applicants:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Dowa F-tec Co., Ltd., Okayama, JP;

Inventors:

Satoru Tsuboi, Okayama, JP;

Yasunobu Mishima, Okayama, JP;

Keisuke Ayabe, Okayama, JP;

Masayasu Senda, Okayama, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 1/03 (2006.01); H01F 1/11 (2006.01); C01G 49/00 (2006.01); H01F 7/02 (2006.01); H01F 1/113 (2006.01);
U.S. Cl.
CPC ...
H01F 1/0315 (2013.01); C01G 49/0036 (2013.01); H01F 1/11 (2013.01); H01F 1/111 (2013.01); H01F 7/02 (2013.01); C01P 2004/51 (2013.01); C01P 2004/52 (2013.01); C01P 2004/61 (2013.01); C01P 2006/12 (2013.01); C01P 2006/42 (2013.01); H01F 1/113 (2013.01);
Abstract

A ferrite powder for bonded magnets having a high iHc value usable even in a low temperature environment, a method for producing the same, and a bonded magnet using the ferrite powder and having high iHc value which can be used even in a low temperature environment, wherein a specific surface area is 2.20 m/g or more and less than 3.20 m/g; a compression density is 3.30 g/cmor more and less than 3.60 g/cm, and a compressed molding has a coercive force of 3250 Oe or more and less than 3800 Oe.


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