The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Jun. 29, 2017
Applicant:

Sonix, Inc., Springfield, VA (US);

Inventor:

Michael Lemley Wright, Fredericksburg, VA (US);

Assignee:

SONIX, Inc., Springfiled, VA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B25B 11/00 (2006.01); G01N 29/22 (2006.01); G01N 29/06 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
G01N 29/223 (2013.01); G01N 29/069 (2013.01); H01L 21/67288 (2013.01); H01L 21/6838 (2013.01); G01N 2291/0231 (2013.01);
Abstract

A wafer chuck includes a support structure having a first side structurally configured to support a wafer, and a vacuum zone formed on the first side of the support structure. The vacuum zone may be at least partially bounded by a ring extending from a recessed surface of the first side of the support structure. The wafer chuck further includes a plurality of suction cups disposed in the vacuum zone, where one or more of the plurality of suction cups is coupled with a channel extending through the support structure. One or more vacuums are in fluid communication with the channel, where a vacuum is structurally configured to provide suction through the channel.


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