The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Dec. 29, 2017
Applicant:

Reno Technologies, Inc., Wilmington, DE (US);

Inventors:

Sean Penley, Sparks, NV (US);

Michael Maeder, Reno, NV (US);

Assignee:

ICHOR SYSTEMS, INC., Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 15/00 (2006.01); G05B 13/02 (2006.01); G01N 7/00 (2006.01); G05D 7/06 (2006.01); G01F 17/00 (2006.01); G05D 7/00 (2006.01); G05D 7/01 (2006.01); G01F 22/02 (2006.01); G01F 25/00 (2006.01); G01F 1/36 (2006.01);
U.S. Cl.
CPC ...
G01F 15/002 (2013.01); G01F 15/005 (2013.01); G01F 17/00 (2013.01); G01F 22/02 (2013.01); G01F 25/0038 (2013.01); G01F 25/0053 (2013.01); G01N 7/00 (2013.01); G05B 13/024 (2013.01); G05D 7/005 (2013.01); G05D 7/0186 (2013.01); G05D 7/0623 (2013.01); G01F 1/36 (2013.01);
Abstract

Apparatuses for controlling gas flow are important components for delivering process gases for semiconductor fabrication. In one embodiment, a method of calibrating an apparatus for controlling gas flow is disclosed. Specifically, the apparatus may be calibrated on installation using a two-step process of measuring the volume of gas box downstream from the apparatus by flowing nitrogen gas into the gas box and measuring the resulting temperature and rate of pressure rise. Using the computed volume of the gas box, a sweep of several mass flow rates may be performed using the process gas and the gas map for the process gas. The apparatus is calibrated based on the measured temperature and pressure values, which allow calculation of the actual mass flow rate for the process gas as compared with the commanded mass flow rates.


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