The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Aug. 14, 2019
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Shinya Fujiwara, Itami, JP;

Yasuaki Higuchi, Itami, JP;

Assignee:

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 5/28 (2006.01); H01L 21/02 (2006.01); B24B 37/10 (2012.01); B24B 57/02 (2006.01); C30B 25/20 (2006.01); C30B 29/40 (2006.01); C30B 33/00 (2006.01); G01Q 60/24 (2010.01); H01L 29/20 (2006.01); H01L 29/34 (2006.01); B24B 37/08 (2012.01); H01L 33/00 (2010.01); C30B 11/00 (2006.01);
U.S. Cl.
CPC ...
G01B 5/28 (2013.01); B24B 37/08 (2013.01); B24B 37/10 (2013.01); B24B 37/105 (2013.01); B24B 57/02 (2013.01); C30B 25/20 (2013.01); C30B 29/40 (2013.01); C30B 33/00 (2013.01); G01B 5/285 (2013.01); G01Q 60/24 (2013.01); H01L 21/02008 (2013.01); H01L 21/02013 (2013.01); H01L 21/02016 (2013.01); H01L 21/02024 (2013.01); H01L 29/20 (2013.01); H01L 29/34 (2013.01); C30B 11/00 (2013.01); H01L 21/0243 (2013.01); H01L 21/02392 (2013.01); H01L 21/02461 (2013.01); H01L 33/0062 (2013.01);
Abstract

An indium phosphide substrate, a method of inspecting thereof and a method of producing thereof are provided, by which an epitaxial film grown on the substrate is rendered excellently uniform, thereby allowing improvement in PL characteristics and electrical characteristics of an epitaxial wafer formed using this epitaxial film. The indium phosphide substrate has a first main surface and a second main surface, a surface roughness Ra1 at a center position on the first main surface, and surface roughnesses Ra2, Ra3, Ra4, and Ra5 at four positions arranged equidistantly along an outer edge of the first main surface and located at a distance of 5 mm inwardly from the outer edge. An average value mof the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.5 nm or less, and a standard deviation σ1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.2 nm or less.


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