The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Jun. 06, 2017
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Li-Kuang Tan, Taoyuan, TW;

Shih-Kang Lin, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); F28D 15/04 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/427 (2006.01); B23P 15/26 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0275 (2013.01); B23P 15/26 (2013.01); F28D 15/0233 (2013.01); F28D 15/0266 (2013.01); F28D 15/046 (2013.01); H01L 21/4882 (2013.01); H01L 23/3736 (2013.01); H01L 23/427 (2013.01); H01L 23/3672 (2013.01); Y10T 29/49353 (2015.01); Y10T 29/49359 (2015.01);
Abstract

A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.


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