The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Dec. 18, 2015
Kyoraku Co., Ltd., Kyoto-Shi, Kyoto, JP;
Masaaki Onodera, Yamato, JP;
KYORAKU CO., LTD., Kyoto, JP;
Abstract
Provided is a blow-molding method capable of suppressing generation of blister-like bubbles and producing a high quality hollow molded article when forming a thick hollow molded article by blow-molding. A blow-molding method includes setting a die-slit interval in a die head according to a target wall thickness of a hollow molded article to be molded, extruding a molten resin in an accumulator into a cylindrical shape from the die slit to form a parison, and molding the parison in a mold. The die-slit interval is made smaller than a value set according to the target wall thickness at start of extrusion, and then is increased to match the value set according to the target wall thickness. The value set according to the target wall thickness is preferably corrected considering wall thickness reduction due to drawdown. The wall thickness of the hollow molded article is preferably 3.5 mm or more.