The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Dec. 17, 2015
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Shriram Sethuraman, Cambridge, MA (US);

Ajay Anand, Cambridge, MA (US);

William Tao Shi, Cambridge, MA (US);

Assignee:

KONINKLIJKE PHILIPS N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/08 (2006.01); A61N 7/02 (2006.01); A61B 8/00 (2006.01); A61N 7/00 (2006.01); A61B 8/12 (2006.01);
U.S. Cl.
CPC ...
A61B 8/485 (2013.01); A61B 8/58 (2013.01); A61N 7/00 (2013.01); A61N 7/02 (2013.01); A61B 8/085 (2013.01); A61B 8/12 (2013.01);
Abstract

An apparatus for deriving tissue temperature from thermal strain includes a thermal strain measuring module. The module uses ultrasound () to measure thermal strain in a region, within a subject, that surrounds a location () where a temperature sensor is disposed. Also included is a temperature measurement module configured for, via the sensor, measuring a temperature at the sensor while the sensor is inside the subject. Further included is a patient-specific thermal-strain-to-temperature-change proportionality calibration module. The calibration module is configured for calibrating (S) a coefficient and for doing so based on a measurement of a temperature parameter at that location derived from output of the temperature measurement module and on a measurement of thermal strain at that location obtained via the strain measuring module. The coefficient is usable, in conjunction with a thermal strain measurement derived from another location within the region, in evaluating (S), for that other location, another temperature parameter.


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