The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Jul. 10, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kyung Il Cho, Seoul, KR;

Jong Keun Song, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01); G01N 29/24 (2006.01); G10K 11/34 (2006.01); A61B 8/14 (2006.01); A61B 8/08 (2006.01); B06B 1/02 (2006.01); B06B 1/06 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4494 (2013.01); A61B 8/00 (2013.01); A61B 8/145 (2013.01); A61B 8/4444 (2013.01); A61B 8/5207 (2013.01); B06B 1/0207 (2013.01); B06B 1/0607 (2013.01); G01N 29/24 (2013.01); G01N 29/2406 (2013.01); G01N 29/2437 (2013.01); G10K 11/346 (2013.01);
Abstract

An embodiment of the disclosure provides an ultrasound probe including a single large-area ASIC in which a plurality of ultrasonic transducer elements are bonded. According to an embodiment, an ultrasound probe comprises: a transducer array including a plurality of transducer elements configured to transmit or receive ultrasound; and an integrated circuit, in which the transducer array is bonded, including a plurality of driving elements corresponding to the plurality of transducer elements, wherein the integrated circuit comprises a time delay table configured to output time delay information regarding respective ultrasound transmission and reception of the plurality of transducer elements.


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