The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

May. 20, 2019
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Takuro Suyama, Ina, JP;

Takatoshi Igarashi, Ina, JP;

Kensuke Suga, Nagano, JP;

Yoshiro Nishimura, Okaya, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/04 (2006.01); A61B 1/05 (2006.01); H01L 23/00 (2006.01); A61B 1/00 (2006.01); A61B 1/045 (2006.01); H01L 23/31 (2006.01); H04N 5/225 (2006.01); G02B 23/24 (2006.01); H01L 27/146 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H04N 5/369 (2011.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
A61B 1/051 (2013.01); A61B 1/00009 (2013.01); A61B 1/00114 (2013.01); A61B 1/00124 (2013.01); A61B 1/045 (2013.01); G02B 23/2484 (2013.01); H01L 23/3142 (2013.01); H01L 23/481 (2013.01); H01L 23/5384 (2013.01); H01L 23/562 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 27/1469 (2013.01); H04N 5/22521 (2018.08); H04N 5/369 (2013.01); H01L 21/76898 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14141 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/17517 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/3512 (2013.01); H04N 2005/2255 (2013.01);
Abstract

An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.


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