The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Jun. 17, 2016
Applicant:
Board of Regents, the University of Texas System, Austin, TX (US);
Inventors:
Ryan B. Wicker, El Paso, TX (US);
Francisco Medina, El Paso, TX (US);
Eric MacDonald, El Paso, TX (US);
Danny W. Muse, El Paso, TX (US);
David Espalin, El Paso, TX (US);
Assignee:
Board of Regents, The University of Texas System, Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); B33Y 80/00 (2015.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/103 (2013.01); B33Y 80/00 (2014.12); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H05K 1/0284 (2013.01); H05K 1/0296 (2013.01); H05K 3/321 (2013.01); H05K 3/328 (2013.01); H05K 3/34 (2013.01); H01L 24/45 (2013.01); H01L 24/49 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/4847 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85214 (2013.01); H01L 2224/85238 (2013.01); H01L 2224/85801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/181 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/049 (2013.01); Y10T 29/49155 (2015.01); Y10T 29/5193 (2015.01);
Abstract
Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.